1. Ukuhlanganiswa kweCandelo leeFomu eziQhelekileyo kakhulu
Itekhnoloji ye-LTCC ivumela ukuhlanganiswa koxinano oluphezulu lwezinto ezingasebenziyo ezisebenza kwiireyithingi eziphezulu (iibhendi ze-10 MHz ukuya kwi-terahertz) ngokusebenzisa izakhiwo zeseramikhi ezininzi kunye neenkqubo zokuprinta umqhubi wesilivere, kuquka:
2. Izihluzi:Izihluzi ze-bandpass ezintsha ze-LTCC ezinezitezi ezininzi, ezisebenzisa uyilo lwe-lumped-parameter kunye nokudubulana okuphantsi kobushushu (800–900°C), zibalulekile kwizikhululo zesiseko ze-5G kunye neefowuni eziphathwayo, zithintela ngempumelelo ukuphazamiseka okungaphandle kwebhendi kwaye ziphucula ubumsulwa besignali. Izihluzi ezigoqiweyo ze-millimeter-wave ziphucula ukwaliwa kwebhendi yokumisa kwaye zinciphisa ubungakanani besekethe ngokusebenzisa ukudibana okunqamlezileyo kunye nezakhiwo ezifakwe kwi-3D, ukuhlangabezana neemfuno zonxibelelwano lwe-radar kunye nesathelayithi.
3. Ii-Antennas kunye nabahluli bamandla:Izixhobo ezihlala zisebenza ngombane eziphantsi (ε r = 5–10) zidityaniswe nokuprintwa kwesilivere okuchanekileyo kuxhasa ukwenziwa kwee-antennas ze-Q eziphezulu, ii-couplers, kunye nezahluli zamandla, okuphucula ukusebenza kwe-RF front-end
Izicelo eziphambili kuNxibelelwano lwe-5G
Izikhululo zesiseko ze-1.5G kunye neeTerminali:Izihluzi ze-LTCC, ezineenzuzo zobukhulu obuncinci, i-bandwidth ebanzi, kunye nokuthembeka okuphezulu, ziye zaba zizisombululo eziphambili ze-5G Sub-6GHz kunye nee-millimeter-wave bands, zithatha indawo yezihluzi zemveli ze-SAW/BAW.
Iimodyuli ze-2.RF Front-End:Ukuhlanganiswa kwezinto ezingasebenziyo (ii-LC filters, ii-duplexers, ii-baluns) kunye nee-chips ezisebenzayo (umz., ii-power amplifiers) kwiimodyuli ze-SiP ezincinci kunciphisa ukulahleka kwesignali kwaye kuphucula ukusebenza kakuhle kwenkqubo.
3. Iingenelo zobugcisa Ukuqhuba Ubuchule
Ukusebenza rhoqo kunye nobushushu obuphezulu:Ukulahleka okuphantsi kwe-dielectric (tanδ <0.002) kunye nokuqhuba okuphezulu kobushushu (2–3 W/m·K) kuqinisekisa ukuhanjiswa kwesignali okuzinzileyo kunye nolawulo oluphuculweyo lobushushu kwizicelo zamandla aphezulu57.
Amandla okudibanisa i-3D:Ii-substrates ezininzi ezinee-substitutes ezifakwe ngaphakathi (ii-capacitors, ii-inductors) zinciphisa iimfuno zokuxhoma kumphezulu, zifezekisa ukunciphisa ivolumu yesekethe engaphezulu kwama-50%.
I-Chengdu Concept Microwave Technology CO.,Ltd ngumvelisi ochwephesha wezixhobo ze-5G/6G RF eTshayina, kuquka isihluzi se-RF lowpass, isihluzi se-highpass, isihluzi se-bandpass, isihluzi se-notch/i-band stop, i-duplexer, i-Power divider kunye ne-directional coupler. Zonke zingenziwa ngokwezifiso ngokweemfuno zakho.
Wamkelekile kwiwebhu yethu:www.concept-mw.comokanye uqhagamshelane nathi kule dilesi:sales@concept-mw.com
Ixesha leposi: Matshi-11-2025

