Itekhnoloji yeCeramic eQhelekileyo yoBushushu obuphantsi (LTCC)

Isishwankathelo

I-LTCC (i-Low-Temperature Co-Fired Ceramic) yiteknoloji yokudibanisa izinto ezikwiqondo lobushushu eliphantsi eyavela ngo-1982 kwaye ukususela ngoko iye yaba sisisombululo esiphambili sokudibanisa izinto ezingasebenziyo. Iqhuba ubuchule kwicandelo lezinto ezingasebenziyo kwaye imele indawo yokukhula okukhulu kushishino lwe-elektroniki.

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Inkqubo yoMveliso

1. Ukulungiswa kwezinto:Umgubo weseramikhi, umgubo weglasi, kunye nezihlanganisi zendalo ziyaxutywa, ziphoswe kwiiteyiphu eziluhlaza nge-tape casting, zize zomiswe23.
2. Ukwenziwa kweepateni:Imizobo yesekethe iprintwa kwiscreen kwiiteyiphu eziluhlaza kusetyenziswa intlama yesilivere eqhubayo. Ukubhola nge-laser ngaphambi kokuprinta kungenziwa ukuze kwenziwe ii-interlayer vias ezizaliswe yintlama eqhubayo23.
3. Ukucoca kunye nokuSinta:Iileya ezininzi ezineepateni zilungelelaniswe, zibekwe ndawonye, ​​kwaye zicinezelwe ngobushushu. Indibano itshiswa kwi-850–900°C ukuze yenze isakhiwo se-3D esi-monolithic12.
4. Emva kokucubungula:Ii-electrode eziveziweyo zingafakwa kwi-tin-lead alloy plating ukuze zikwazi ukunyibilikisa i-solder3.

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Thelekisa ne-HTCC

I-HTCC (i-High-Temperature Co-Fired Ceramic), ubuchwepheshe bangaphambili, ayinazo izongezo zeglasi kwiileya zayo zeseramikhi, ezifuna ukutshiswa kwi-1300–1600°C. Oku kunciphisa izixhobo ze-conductor kwiintsimbi ezinamaqondo aphezulu okunyibilika ezifana ne-tungsten okanye i-molybdenum, ezibonisa ukuhanjiswa kombane okuphantsi xa kuthelekiswa nesilivere okanye igolide ye-LTCC34.

Iingenelo eziphambili

1. Ukusebenza ngokuQhelekileyo kakhulu:Izixhobo ze-dielectric constant eziphantsi (ε r = 5–10) ezidityaniswe nesilivere ene-conductivity ephezulu zivumela ii-high-Q, ii-frequency components (10 MHz–10 GHz+), kuquka izihluzi, ii-antenna, kunye nezihluzi zamandla13.
2. Amandla okuhlanganisa:Ilungiselela iisekethe ezininzi ukufaka izinto ezingasebenziyo (umz., ii-resistors, ii-capacitors, ii-inductors) kunye nezixhobo ezisebenzayo (umz., ii-ICs, ii-transistors) kwiimodyuli ezincinci, ezixhasa uyilo lweSystem-in-Package (SiP)14.
3. Ukunciphisa i-aaturization:Izixhobo ze-high-ε r​​r >60) zinciphisa unyawo lwee-capacitors kunye nezihluzi, nto leyo evumela izinto ezincinci zesimo35.

Izicelo

1. Izixhobo ze-elektroniki zabathengi:Ilawula iifowuni eziphathwayo (isabelo semarike esingama-80% nangaphezulu), iimodyuli zeBluetooth, izixhobo zeGPS, kunye neWLAN
2. Iimoto kunye neenqwelo-moya:Ukwanda kokwamkelwa ngenxa yokuthembeka okuphezulu kwiindawo ezinzima
3. Iimodyuli eziPhambili:Ibandakanya izihluzi ze-LC, ii-duplexers, ii-balun, kunye neemodyuli ze-RF front-end

I-Chengdu Concept Microwave Technology CO.,Ltd ngumvelisi ochwephesha wezixhobo ze-5G/6G RF eTshayina, kuquka isihluzi se-RF lowpass, isihluzi se-highpass, isihluzi se-bandpass, isihluzi se-notch/i-band stop, i-duplexer, i-Power divider kunye ne-directional coupler. Zonke zingenziwa ngokwezifiso ngokweemfuno zakho.
Wamkelekile kwiwebhu yethu:www.concept-mw.comokanye uqhagamshelane nathi kule dilesi:sales@concept-mw.com


Ixesha leposi: Matshi-11-2025